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ISO 9001:2015
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In the case of solder material, halogens such as Cl, Br, etc. are used in the flux to improve solder wettability and workability. However, dioxins, which is harmful to living things, may be generated when incinerating an electronic board containing halogen, Cl or Br.
Halogen free is for measures of dioxin, to try to regulate the halogen to be used for the electronic board.
| Standard | Contents of standard |
|---|---|
| JPCA-ES01 IEC61249-2-21 IPC4101B | Halogen content in the copper-clad laminate Chlorine (Cl) content: 900 ppm or less Bromine (Br) content: 900 ppm or less Total amount of chlorine (Cl) and bromine (Br) content: 1500 ppm |
| 規格 | 規格の内容 |
|---|---|
| JEITA_ET-7304A | Halogen content of solid content in solder material flux Fluorine (F) content: less than 1000 ppm Chlorine (Cl) content: less than 1000 ppm Bromine (Br) content: less than 1000 ppm Iodine (I) content: less than 1000 ppm |
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