M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Apply colorless base material suppress the coloring of the residue.Beautiful soldering appearance persists without discoloration long time after SMT.
●Comparison of residues after reflow
Ensure high quality soldering in illumination equipment such as LEC lamps
Optimization of the type and amount of activator keep the insulative even at high temperatures.Malfunction of the LED lighting equipment is prevented under harsh environment.
●Insulation resistance test at 85℃ and 120℃
Stable insulation resistance
Test PCB:JIS-Ⅱ
Test voltage:100V
Corresponds to the low-Ag alloy, and already it has been approved by several users.Low-Ag alloy helps reducing material cost.
●Wetting result with Low Ag(Sn-0.3Ag-0.7Cu)alloy
Good wettability for low Ag
Condition:Atmospheric
Pre heating:150℃～170℃,100 sec
Heating:230～255℃,60 sec
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | Less than 0.03% |
| Powder particle size（μm） | 38～25(Equivalent to type4) |
| Flux contents（％） | 11.7% |
| Deterioration（Pa・S） | 200 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 8860 |
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