M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Suitable materials for rapid heating by LASER.Sufficient wettability even at low output, and reduces heat damage to the mounted components.
●Wettability test by light beam to Ni
Ensures good wettability even at low output
【Condition】
Beam power:22W
Wire diameter:φ0.8mm Preheat:0.2s
Feed:5mm/s, 1.0s
Postheat:0.2s
Pad:Ni, 3mm■
No intentional addition of chlorine(Cl) and bromine(Br), Which causes dioxins.Compliant with most of halogen-free standards.
●Compliant situation of EYP series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non compliant |
Apply suitable flux base material for higher melting point alloy.Very few flux spattering can achieve high performance soldering.
●Flux spattering test by using soldering iron robot
Reduce flux spattering Collect spattered flux onto thermal paper. 【Condition】 |  |
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen-free type |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.1%～0.6% |
| Copper plate corrosion test | No corrosion |
| Insulation resistance（Ω） | More than 1.0×107Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | EYP |
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