Management System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Home > Lead-free (EVASOL) > [Flux cored solder wire] For Aluminum wire soldering K4-C601-3
Solderable by iron to aluminum wire, used such as in the HDD of the actuator.
●Soldering test to aluminum
Solderable to aluminum
Put solder wire on aluminum board and heat by 270℃
Additive elements achieve high soldering reliability and prevent the galvanic corrosion that occurs between the aluminum material and solder.
●Electrolytic corrosion test
Measure the time until the solder delamination occurs, stored in 40℃ of artificial seawater, after soldering the two aluminum plates
Apply water-soluble base material instead of rosin.The residue after soldering is possible to wash away easily with water.
●Ionic residue test
The flux residue is possible to clean with water
【Test method】JIS Z 3197 8.5.2
【Condition】
Cleaning solution:Pure water
Washing temp:50℃
Washing time:1min
Number of washings:3 times
Alloy type | K4 (Sn:Bal / Ag 3.5 / Ni 0.2) |
---|---|
Flux type | Fluorine type |
Flux contents (%) | 3.0% |
Halide contents | 17%~23% |
Copper plate corrosion test | No corrosion (after cleaning with water) |
Insulation resistance(Ω) | More than 1.0×108Ω (after cleaning with water) |
Electrochemical migration | No migration (after cleaning with water) |
Fluorine contents(%) | 20% |
Flux name | C601 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.