Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond

Management System
ISO 9001:2015 
ISO 14001:2015

Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com

Flux cored solder wire

Good wettability type list

Flux name Alloy type Flux type Halide contents(%) Characteristics
MFJ J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7) JIS-A MIL-RMA 0.08%~0.14% Good wettability type
MYK J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R8 (Sn:Bal / Cu 0.7) JIS-A MIL-RMA 0.08%~0.14% Less spattering type
ESK J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) Fluorine type 0.1%~0.4% Non-cleaning type for stainless steel,nickel,brass
EAN K4 (Sn:Bal / Ag 3.5 / Ni 0.2) Fluorine type less than 0.3% Non-cleaning type for aluminum
DDL J3 (Sn:Bal / Ag 3.0 / Cu 0.5) JIS-AA 0.06%~0.10% Residue crack preventing type
HRK J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55) Harogen-free type 0.08%~0.50% High reliability H/F type (Iodine containing)
EYP J3 (Sn:Bal / Ag 3.0 / Cu 0.5) Halogen-free type 0.1%~0.6% Good wettability H/F type (Iodine containing)
HFC J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) R3 (Sn:Bal / Cu 0.55) Halogen free type less than 0.3% Halogen-free (Completely halogen free)
WSG J3 (Sn:Bal / Ag 3.0 / Cu 0.5) J9 (Sn:Bal / Ag 3.5 / Cu 0.7) Water soluble type 1.6%~2.4% Water soluble type
C601 K4 (Sn:Bal / Ag 3.5 / Ni 0.2) Fluorine type 17%~23% Aluminum wire compliant type

◎ → Excellent 〇 → Good △ → Normal × → Not applicable

Form number Wettability Spattering Residue crack preventing Need to wash ? soldering method Compatible base material
Cu S/S Ni Al
MFJ series × No Iron × ×
MYK series No Iron、LASER × ×
ESK series × No Iron、LASER ×
EAN series × No Iron
DDL series No Iron、LASER × ×
HRK series × No Iron、LASER × ×
EYP series × No Iron、LASER ×
HFC series × No Iron × ×
WSG series Yes Iron × ×
K4-C601-3 Yes Iron