[Solder paste (bottle)] Low residue type 6001 series

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Solder paste (bottle)

Low residue type 6001 series

Applicable for ICT testing

Reduce failure ratio of ICT test.Select special base material to reduce flux residue after soldering.

Very low failure ratio on ICT

●Residue penetrate force test

Penetrating force is lower than regular product
Reflow with N2(O2 ratio 1000ppm) and measure penetrating force of checker pin with 10mm/sec speed until get contact

Good wettability

Apply special activator and achieved to get good wettability although the flux residue is lesser than regular solder paste

Good wettability

●Continuous wettability test

【Conditions】
Reflow with N2
O2 ratio 1000ppm
0.5mm pitch QFP
Stencil thickness 0.15mm

Stable printing quality

Prevent reaction between flux and solder powder and stabilize printing quality during long time continuous printing of paste.

Good stability on continuous printing

●Shape of printed solder paste

Stable shape after long time printing
0.3mm QFP
Stencil thickness:0.12mm

Alloy type	J3 (Sn:Bal / Ag 3.0 / Cu 0.5)
Flux type	MIL-RMA
Halide contents	0.01%～0.05％
Powder particle size（μm）	45～25(Type 3)
Flux contents（％）	10.5%
Deterioration（Pa・S）	195
Copper plate corrosion test	No corrosion
Copper mirror corrosion	No corrosion
Insulation resistance（Ω）	More than 5.0×10⁸Ω
Electrochemical migration	No migration
Flux name	6001

Ishikawa Metal Co. Ltd is Lead-free solder manufactuer and sales in Helmond