M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Adding material which faciliated that the gas in the molten solder comes out, it may reduce the remaining of voids.
●Comparison of voids after continuous printing
Stable void reduction
No intentional addition of chlorine(Cl) bromine(Br), which generate dioxins.Compliant with most of halogen-free standards
●Compliant situation of 7510 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non Compliant |
Comply to all of halogen free standards
Higher heat resistance can reduce defect of non-wetting and non-melting
●Confirmation of wettability by reflow
Less void in large parts
Condition:Atmospheric
Pre heat:180℃,120 seconds
Component:6mm■ parts
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.01％ |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 11.5% |
| Deterioration（Pa・S） | 180 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 50 Br : Less than 100 |
| Flux name | 7510 |
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