M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Use a material that is highly miscible with solvents for the flux base.Improves the washability of the residue.
●Ionic residue test
After 1 min washing with IPA at 40℃, measure the amount oof ions.
Good washability in the ionic residue test
No intentional addition of chlorine(Cl) and bromine(Br), which generate dioxins.Compliant with most of halogen-free standards.
●Compliant situation of 8825 series
| Standards | Compliant situation |
|---|---|
| JPCA-ES01 | Compliant |
| IEC61249-2-21 | Compliant |
| IPC4101B | Compliant |
| JEITA ET-7304A | Non Compliant |
Comply to all of halogen free standards
Prevents the reaction of the flux and powder,in order to prevent the viscosity increasement during continuous printing.Enable to implement stability.
●Confirmation of the shape of the printed solder paste
Stable shape after long time printing
0.5mm QFP
Stencil thickness:0.15mm
| Alloy type | J3 (Sn:bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | Halogen free |
| Halide contents | Less than 0.01% |
| Powder particle size（μm） | 38～25(Equivalent to type 4) |
| Flux contents（％） | 11.0% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Halogen contents（ppm） | Cl : Less than 900 Br : Less than 900 |
| Flux name | 8825 |
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