M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Higher heat resistance can reduce defect of non-wetting and non-melting
●High temperature preheating test
Good wettability in severe conditions
Condition:Atmospheric
Pre heat:200℃ 120 seconds
Component:0.4mm pitch QFP φ0.30mm dot
Prevent quality deterioration during transportation.
●35℃ deterioration test
Prevent quality deterioration during transportation
With new technology of controlling activator at room temperature, stable at long time printing and transportation.
●Confirmation of the shape of the printed solder paste
Stable shape after long time printing
J3-1001-UG(3Ag)
0.4mm pitch QFP
Stencil thickness:0.12mm
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | Less than 0.02% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 12.0% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 1001 |
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | Less than 0.02% |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 12.0% |
| Deterioration（Pa・S） | 190 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 5.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 1001 |
Copyright © Ishikawa Metal Co.,LTD. All Rights Reserved.
Products