M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Use special fluorine compound as the activater.Strong activation enables to solder to aluminum parts which is so difficult to solder.
●Soldering example
Suppress the corrosion and achive to secure the reliability after soldering. Cleaning of flux residue is not required like the general flux cored solder wire.
●Copper plate corrosion test
Strong activity and low corrosivity stand side by side
Enables to solder to aluminum wire, which was impossible in the past, and to allow for the introduction of aluminum wire in wide range of applications.
●Applications
| Alloy type | K4 (Sn:Bal / Ag 3.5 / Ni 0.2) |
|---|---|
| Flux type | Fluorine type |
| Flux contents (%) | 3.0% |
| Halide contents | less than 0.3％ |
| Copper plate corrosion test | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Fluorine contents（％） | 0.6％～0.8％ |
| Flux name | EAN |
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