M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Special activater enables rapid heating SMT by LASER.Solution of solder ball by reducing slumps in heat.
●Comparison of solder ball
No solder ball by rapid heating
1608 chip
LASER power:40W
Special designed for the soldering of micro-components, Solution for peculiar problems of micro components.
EVASOL 3230 series is special designed for micro-components.Please use the 3229 series for large parts.
●Applicable example
Smaller chip components than 1608
Camera module of smartphone etc.
●Inapplicable example
Through-hole parts, connectors
Preventing the reaction of flux and powder.Achieve high dispensing stability, even in very small discharge.
●Continuous dispense test
Stable dispense volume
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) |
|---|---|
| Flux type | MIL-RMA |
| Halide contents | 0.08％～0.1％ |
| Powder particle size（μm） | 38～20(Type 4) |
| Flux contents（％） | 14.5% |
| Deterioration（Pa・S） | 100 |
| Copper plate corrosion test | No corrosion |
| Copper mirror corrosion | No corrosion |
| Insulation resistance（Ω） | More than 1.0×108Ω |
| Electrochemical migration | No migration |
| Flux name | 3230 |
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