M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Apply flux activator according to base material.Good solderbility can achieve higher productivity for various type parts.
●Wettability comparison in line soldering
Sustained wettability
【Condition】
Iron temp:360℃
Iron speed:5mm/s
Water soluble base material instead of rosin.The residue after soldering is possible to clean away easily with water.
●Ionic residue test
The flux residue is possible to clean with water
【Condition】
Cleaning solution:Pure water
Washing temp:50℃
Washing time:1 min
Number of washings:3
With the effect of special activator, solder and flux spattering were reduced.Higher mounting quality can be secured.
●Flux spattering test with soldering iron robot
Few spattering
Collect spattered flux onto thermal paper. 【Condition】 |  |
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) J9 (Sn:Bal / Ag 3.5 / Cu 0.7) |
|---|---|
| Flux type | Water soluble type |
| Flux contents (%) | 2.0％、3.0％ |
| Halide contents | 1.6％～2.4％ |
| Copper plate corrosion test | No corrosion (after cleaning with water) |
| Copper mirror corrosion | No corrosion (after cleaning with water) |
| Insulation resistance（Ω） | More than 1.0×108Ω (after cleaning with water) |
| Electrochemical migration | No migration (after cleaning with water) |
| Flux name | WSG |
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