M
anagement System
ISO 9001:2015
ISO 14001:2015
Marshallstraat 18c, 5705 CN Helmond
Tel:+31-655701610
soldersolutions@ishikawa-europe.com
Suppress the corrosion to secure the reliability after solderig.Cleaning of flux residue is not required like the general flux cored solder wire.
●Wettability test for stainless steel plate
Good solderability also in stainless steel
【Condition】
Iron temp:380℃
Base material:SUS304
Use a fluorine-based special activater. Strong activation force produces good workability for flame base material such as nickel and brass.
●Wettability test for Ni pad
Good wettability enabls to shorten working time.
【Condition】
Iron temp:370℃
Pad:Ni,3mm■
Soldering time:2.5s/point
Apply water-soluble base material instead of rosin.The residue after soldering is possible to wash away easily with water.
●Copper plate corrosion test
Strong activity and low corrosivity stand side by side
| Alloy type | J3 (Sn:Bal / Ag 3.0 / Cu 0.5) R4 (Sn:Bal / Ag 0.3 / Cu 0.7) |
|---|---|
| Flux type | Fluorine type |
| Flux contents (%) | 3.0％、4.0％、6.0％ |
| Halide contents | 0.1％～0.4％ |
| Copper plate corrosion test | No corrosion |
| Insulation resistance（Ω） | More than 1.0×107Ω |
| Electrochemical migration | No migration |
| Fluorine contents（％） | 0.2％～0.4％ |
| Flux name | ESK |
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